1. Adhesion in Microelectronics
Author: \ Edited by K.L. Mittal and Tanweer Ahsan
Library: Library of Foreign Languages and Islamic Sources (Qom)
Subject: Microelectronic packaging -- Materials.,Adhesives.,نصب تجهیزات میکرو الکترونیکی -- مواد,چسبانندهها
Classification :
E-Book
,
2. Adhesives technology for electronic applications :
Author: James J. Licari and Dale W. Swanson.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives.,Electronic packaging.,Electronics-- Materials.
3. Adhesives technology for electronic applications :
Author: by James J. Licari and Dale W. Swanson
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesives,Electronic packaging,Electronics-- Materials
Classification :
TK7871
.
L53
2005
4. Adhesives technology for electronic applications
Author: by James J. Licari and Dale W. Swanson
Library: Library of Institute For Color Science and Technology (Tehran)
Subject: Electronics- Materials,Adhesives,Electronic packaging
5. Advanced adhesives in electronics :
Author: edited by M.O. Alam and C. Bailey.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Adhesive joints.,Adhesives-- Electric properties.,Adhesives.,Electronic packaging-- Materials.,Electronics-- Materials.
Classification :
TK7871
.
A38
2011
6. Advanced materials for thermal management of electronic packaging
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Electronic apparatus and appliances ; Temperature control. ; Electronic packaging ; Materials. ;
7. Advanced materials for thermal management of electronic packaging
Author: Xingcun Colin Tong
Library: Central Library and Information Center of Shahed University (Tehran)
Subject: Electronic apparatus and appliances, Temperature control,Electronic packaging, Materials
Classification :
TK
،
7870
.
15
،.
T56
،
2011
8. Advanced materials for thermal management of electronic packaging
Author: / Xingcun Colin Tong
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Electronic apparatus and appliances, Temperature control,Electronic packaging, Materials
Classification :
E-BOOK
9. Advanced organics for electronic substrates and packages
Author: research manager, Andrew E. Fletcher.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging -- Materials.,TECHNOLOGY & ENGINEERING -- Mechanical.
Classification :
TK7870
.
15
R474
9999
10. Advanced thermal management materials
Author: Guosheng Jiang, Liyong Diao, Ken Kuang
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Heat sinks (Electronics),Microelectronic packaging-- Materials-- Thermal properties,Microelectronics-- Cooling
Classification :
TK7874
.
J53
2013
11. Aluminum alloys for Packaging by structural materials division
Author: / edited by J.G. Morris ... [et al]
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Alluminum- Congresses,Composite materials- Packaging
Classification :
TA480
.
A6A177
1993
12. Application of fracture mechanics in electronic packaging and materials : presented at the International Mechanical Engineering Congress and Exposition, November 12-17, 1995, San Francisco, Claifornia
Author: sponsored by the electrical and Electronic Packaging Division, ASME, The Materials Division, ASME ; edited by Tien Y. Wu ... ]et al.[
Library: Central Library of Amirkabir University of Technology (Tehran)
Subject: Electronic packaging - Materials - Congresses , Materials - Electric properties - Congresses
Classification :
TK
7870
.
15
.
A85
1995
13. Bio-based materials for food packaging :
Author: Shakeel Ahmed, editor.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Food-- Packaging-- Materials.,Food-- Packaging-- Materials.,TECHNOLOGY & ENGINEERING-- Food Science.
Classification :
TP374
.
B56
2018
14. Ceramic interconnect technology handboo
Author: / edited by Fred D. Barlow III, Aicha Elshabini
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Electronic ceramics.,Electronic packaging--Materials,Interconnects (Integrated circuit technology)--Design and construction
Classification :
TK
,
7871
.
15
,.
C4
,
C44
,
2007
15. Ceramic interconnect technology handbook
Author: edited by Fred D.
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Electronic ceramics,، Electronic packaging- Materials,، Interconnects )Integrated circuit technology(- Design and construction
Classification :
TK
7871
.
15
.
C4
C44
2007
16. Ceramic interconnect technology handbook
Author: / edited by Fred D. Barlow III, Aicha Elshabini
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Electronic ceramics.,Electronic packaging--Materials,Interconnects (Integrated circuit technology)--Design and construction
Classification :
TK7871
.
15
.
C4
,
C47
2007
17. Ceramic interconnect technology handbook
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Electronic ceramics ; Electronic packaging ; Materials ; Interconnects (Integrated circuit technology) ; Design and construction ;
18. Characterization of integrated circuit packaging materials
Author:
Library: Central Library and Documents Center of Al-Zahra University (Tehran)
Subject: ، Electronic packaging-Materials,، Integrated circuits-Design and construction
Classification :
TK
7870
.
15
.
C53
1993
19. Characterization of integrated circuit packaging materials /
Author: editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging-- Materials,Integrated circuits-- Design and construction
Classification :
TK7870
.
15
.
C52
1993
20. Copper wire bonding
Author: / Preeti S. Chauhan, Anupam Choubey, ZhaoWei Zhong, Michael G. Pecht
Library: Central Library, Center of Documentation and Supply of Scientific Resources (East Azarbaijan)
Subject: Wire bonding (Electronic packaging),Copper wire,Engineering,Optical and Electronic Materials,TECHNOLOGY & ENGINEERING / Mechanical, bisacsh
Classification :
E-BOOK
